SOI high-speed optical switch 1X8
Silicon photonic chips are used for high-speed optical switches. Their principle is similar to demux, which divides a single path of light into multiple paths, and only selects one path at a time.
The current design comprehensively considers the maturity of the process, integration difficulty, and flexibility. In Sample A1, it is decided to adopt a pure optical fiber modular solution, and one module is in the form of 1x8. The input and output of the optical switch use optical fiber/optical fiber array. Purchase modular products, that is, already packaged modules with optical fibers. The module can be directly used by welding on the PCB.
Feature
Multi Channel
Highly integrated chip
High speed response
Application
Fiber optic sensing Fiber optic communication Fiber optic network monitoring and protection LiDAR
Specification
Parameters | Value | Notes |
Wavelength | 1530-1565nm |
|
Optical switch architecture | 1x8 | Bidirectional, TE/TM |
Switching speed | <200ns |
|
Insertion loss | ≤8db | Fiber to fiber (room temperature) |
Extinction ratio | >18db |
|
Crosstalk | >25db | Ratio of incident power to reflected power |
Return loss | >35db |
|
Maximum optical power | 300mW | Input power |
Switching repetition frequency (PRF) | 1MHz |
|
Operating temperature range | - 20 ~ +70°C |
|
Storage temperature | - 40 ~ +85°C |
|
Input mode | Option | Line throw after packaging, PM FC/APC, AR coating |
Output mode | Fiber | Line throw after packaging, PM FC/APC, AR coating |
Switch life | 10years |
|
Electrical parameters
| Value | Note |
1*8 Unit power consumption @300khz Switching frequency (max) | 300mW |
|
Switch drive current (max) | 15mA |
|
Switch control voltage | 2V |
|
Adjust bias current/voltage range | 30mA/3V |
|
Temperature sensor | no | No integrated temperature sensor or TEC |
Chip dimension