Definition
The laser features a modular design, adapting to the demands of 24/7 industrial production and cutting-edge scientific research. It can provide laser output with specific parameters to meet the needs of various micro- and nano-fabrication applications. Its total power reaches 100W, with a minimum pulse width of 200 fs, a single pulse energy of 300 μJ, and a repetition rate that is flexibly adjustable from 25 kHz to 5 MHz.
Feature
Average power: 100W
Pulse width: ~300fs to ~10ps adjustable (200fs version is available)
Peak power: ~1GW
Repetition frequency: 25kHz to 5MHz adjustable
High beam quality: M² < 1.3
Single pulse energy: 300 uJ
Application
Material micro-nano processing
OLED module cutting
Brittle material cutting
Composite film material processing
Semiconductor wafer processing
Lithium battery separator cutting
Diamond processing
Specification
Parameter | Unit | Value |
Center wavelength | nm | ~1030±5 |
Total power | W | 100 |
Repetition frequency | kHz | 25kHz-5MHz adjustable |
Power stability |
| <2% |
Single pulse energy | uJ | 300 |
Number of bursts | Unit | 1-10unit programmable |
Burst pulse group energy | mJ | Up to 2mJ |
Peak power | GW | ~1GW |
Pulse width | fs | ~300fs-6psadjustable (200fs version is available) |
Beam quality |
| M2<1.3 |
Spot diameter | mm | ~3mm(1m away from the output port) |
Spot divergence angle (full angle) |
| <2mrad(IS0-11146-1 definition) |
Polarization direction |
| linear polarization(S) |
Synchronous output |
| SMATTL signal |
Control mode |
| RS232 or DB25 |
Power supply requirements | V | AC100V-240V50/60Hz Rated output power≥2000W |
Overall weight | KG | ~25KG |
Dimensions | mm | 1054x304x162 |
Dimension
