Definition
The laser is a compact, air-cooled picosecond laser designed specifically for high-precision micromachining and material handling. Based on passive mode-locked fiber laser technology, it achieves picosecond-level pulse output through nonlinear polarization rotation (NPR) or semiconductor saturable absorber mirrors (SESAM), with pulse widths ranging from 200 ps to 2 ns, supporting switching between ultrashort and long pulse modes. It employs an air-cooled heat dissipation design, eliminating the need for external water cooling equipment, simplifying system integration and reducing maintenance costs.
Feature
Average power 20W
Peak power up to 300kW
Pulse width adjustable from 200ps to 2ns
High pulse energy
High repetition rate
Supports Burst pulse train function
High beam quality: M² < 1.3
Application
Processing of transparent brittle materials
Lithium battery manufacturing
High-brightness LED chip cutting;
ITO glass film etching;
PERC solar cell scribing;
MEMS device processing;
Thin-film solar cell scribing
Specification
Parameter | Unit | Value |
Central wavelength | nm | 1035 |
Average power | W | 20W |
Repetition frequency | kHz | 30-1000 adjustable |
Power stability |
| <2% |
Single pulse energy | uJ | 30uJ@200ps or 100uj@2ns |
Peak power | kW | 150W |
Pulse width | ps | 200p-2ns adjustable |
Switching response | us | <5 |
Beam quality |
| M2<1.3 |
Beam diameter | mm | ~2mm(1m away from output port) |
Beam divergence angle (full angle) |
| <2mrad (IS0-11146-1defenition) |
Polarization direction |
| Linear polarization(S) |
Synchronous output |
| SMAT TRIGGER signal |
Control mode |
| RS232 or DB25 |
Power supply | V | AC 100V-240V 50/60Hz rated output power ≥ 960W |